Silicon Carbide Hexagonal Ceramic Tile with NIJ Level III Protection 50mm Flat Hexagon Pressureless Sintered SiC

Dettagli:

Luogo di origine: Hunan, Cina
Marca: WNRLN
Certificazione: ISO 9001:2015, NIJ 0101.06
Numero di modello: sì, piastrelle
Documento: SIC Ballistic Armor Tiles-P...ad.pdf

Termini di pagamento e spedizione:

Quantità di ordine minimo: 100000 pezzi
Prezzo: USD 0.1-1 / Piece
Imballaggi particolari: Vassoio in schiuma EPE + sacchetto sottovuoto + custodia in compensato per esportazione
Tempi di consegna: 5-7 giorni lavorativi per stock, 15-20 giorni per produzione
Termini di pagamento: T/T,L/C,Western Union
Capacità di alimentazione: 5000000 pezzi al mese
Miglior prezzo Contatto

Informazioni dettagliate

Densità: 3,10-3,15 g/cm³ Durezza (GPa): 24-27
Resistenza alla flessione: 380-450MPa Dimensione piastrella: Esagono da piatto a piatto da 50 mm
Densità areale: ≤34 kg/m² (serie) Resistenza alla frattura: 3,5-4,5 MPa·m½
Evidenziare:

Hexagonal SiC Ballistic Tile

,

Mosaic Array Strike Face

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NIJ III Ceramic Protection

Descrizione di prodotto

Silicon Carbide Hexagonal Ceramic Ballistic Tile Mosaic Array NIJ Level III Protection Strike Face 50mm Flat Hexagon
SiC Hexagonal Ceramic Ballistic Tile
Mosaic Array Strike Face | 50mm Flat Hex | NIJ Level III
✅ Optimal Packing Density ✅ Reduced Gap Coverage
Why Hexagonal Geometry?
Traditional square tiles leave cross-shaped seams at every corner intersection—potential weak points. The WNRLN SC-50HEX-PS3 hexagonal tile distributes seam lines in a honeycomb pattern, eliminating continuous straight-line gaps. This geometric advantage provides 12-18% higher ceramic coverage density compared to equivalent square tile arrays. Each hex tile is precision-ground to ±0.2mm dimensional tolerance for consistent gap control in automated array assembly.
Hex vs Square: Coverage Density
Hexagonal tiles achieve ~90.7% geometric packing efficiency vs ~78.5% for squares of equivalent area, resulting in fewer vulnerable seam intersections and improved multi-hit resistance across the array.
SiC Hex vs B4C Hex: Cost
Atmospheric sintered SiC hex tiles cost 50-60% less than equivalent hot-pressed B4C hex tiles while delivering 90% of the ballistic performance. The ideal choice for cost-sensitive volume programs.
SiC vs Al2O3 Hex: Weight
At equivalent thickness, SiC hex arrays weigh 16-20% less than Al2O3 hex arrays. This weight saving compounds across larger panel assemblies for vehicle and personnel applications.
Seamless Multi-Tile Integration
Consistent edge chamfer (0.3mm x 45°) on all tiles ensures uniform adhesive bonding gap. Compatible with epoxy, polyurethane, and polysulfide adhesive systems for composite lamination.
Technical Specifications
Material Pressureless Sintered SiC
Shape Regular Hexagon (Flat-to-Flat)
Flat-to-Flat Width 50.0 ± 0.2 mm
Thickness 8.0 mm (6-12mm optional)
Edge Chamfer 0.3mm x 45°
Surface Finish Ground (Ra ≤ 0.8μm)
Density 3.10-3.15 g/cm³
Hardness 2500-2800 HV
Order hexagonal SiC tiles for your mosaic array system today
Email: janehu@hbnewmaterial.com | Custom hex sizes and thickness available

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